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1

Climate Change and Agricultural Ecosystems || Climate Change and Soil Dynamics: Effects on Soil Microbes and Fertility of Soil

Kannojia, Pooja

Year:

2019

Language:

english

File:

PDF, 555 KB

english, 2019

2

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Fabrication and Characterization of Through-glass vias (TGV) based 3D Spiral and Toroidal Inductors by Cost-effective ECDM Process

Kannojia, Harindra K., Arab, Julfekar, Sidhique, Aboobackkar, Mishra, Dileep K., Kumar, Ritesh, Pednekar, Jaisingh, Dixit, Pradeep

Year:

2020

File:

PDF, 663 KB

2020

3

Fabrication of multiple through-holes in non-conductive materials by Electrochemical Discharge Machining for RF MEMS Packaging

Arab, Julfekar, Mishra, Dileep Kumar, Kannojia, Harindra Kumar, Adhale, Pratik, Dixit, Pradeep

Journal:

Journal of Materials Processing Technology

Year:

2019

Language:

english

File:

PDF, 727 KB

english, 2019

4

First report of Fusarium solani causing wilt of Melia dubia

Pandey, A., Juwantha, R., Chandra, S., Kumar, A., Kannojia, P., Khanna, D., Arora, S., Dwivedi, V. D., Pandey, S., Łakomy, P.

Journal:

Forest Pathology

Year:

2017

Language:

english

File:

PDF, 412 KB

english, 2017

5

PGPR Amelioration in Sustainable Agriculture || PGPR Bioelicitors

Kannojia, Pooja

Year:

2019

Language:

english

File:

PDF, 490 KB

english, 2019

6

Void Formation and Intermetallic Growth in Pulse Electrodeposited Cu-Sn Layers for MEMS Packaging

Kannojia, Harindra Kumar, Sharma, Surender Kumar, Dixit, Pradeep

Journal:

Journal of Electronic Materials

Year:

2018

Language:

english

File:

PDF, 4.72 MB

english, 2018

7

[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Void Formation in Low-Temperature Electroplated Cu-Sn Stack for Hermetic Packaging

Kannojia, Harindra Kumar, Dixit, Pradeep

Year:

2019

File:

PDF, 3.01 MB

2019

8

Effect of tool electrode roughness on the geometric characteristics of through-holes formed by ECDM

Arab, Julfekar, Kannojia, Harindra Kumar, Dixit, Pradeep

Journal:

Precision Engineering

Year:

2019

Language:

english

File:

PDF, 15.10 MB

english, 2019

9

[IEEE 2018 5th International Conference on Signal Processing and Integrated Networks (SPIN) - Noida (2018.2.22-2018.2.23)] 2018 5th International Conference on Signal Processing and Integrated Networks (SPIN) - Ensemble of Hybrid CNN-ELM Model for Image Classification

Kannojia, Suresh Prasad, Jaiswal, Gaurav

Year:

2018

Language:

english

File:

PDF, 698 KB

english, 2018

10

Effect of surface roughness on void formation and intermetallic growth in electrodeposited Cu-Sn stacks

Kannojia, Harindra Kumar, Dixit, Pradeep

Journal:

Materials Letters

Year:

2019

File:

PDF, 1.59 MB

2019

11

XOR-based unexpanded meaningful visual secret sharing scheme

Kannojia, Suresh Prasad, Kumar, Jasvant

Journal:

International Journal of Security and Networks

Year:

2019

Language:

english

File:

PDF, 2.01 MB

english, 2019

12

Experimental investigations in the intermetallic and microvoid formation in sub-200 °C Cu–Sn bonding

Kannojia, Harindra Kumar, Dixit, Pradeep

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2019

Language:

english

File:

PDF, 3.69 MB

english, 2019

13

[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Formation of Through-Wafer 3-D Interconnects in Fused Silica Substrates by Electrochemical Discharge Machining

Kannojia, Harindra Kumar, Arab, Julfekar, Kumar, Ritesh, Pednekar, Jaisingh, Dixit, Pradeep

Year:

2019

File:

PDF, 851 KB

2019

14

[IEEE 2012 International Conference on Communication Systems and Network Technologies (CSNT) - Rajkot, Gujarat, India (2012.05.11-2012.05.13)] 2012 International Conference on Communication Systems and Network Technologies - Languages and Their Importance in Quality Software

Singh, Brijendra, Kannojia, S.P.

Year:

2012

Language:

english

File:

PDF, 288 KB

english, 2012

15

Fabrication of multiple through-holes in non-conductive materials by Electrochemical Discharge Machining for RF MEMS Packaging

Arab, Julfekar, Mishra, Dileep Kumar, Kannojia, Harindra Kumar, Adhale, Pratik, Dixit, Pradeep

Journal:

Journal of Materials Processing Technology

Year:

2019

File:

PDF, 727 KB

2019

16

[IEEE 2013 International Conference on Communication Systems and Network Technologies (CSNT 2013) - Gwalior (2013.4.6-2013.4.8)] 2013 International Conference on Communication Systems and Network Technologies - A Review on Software Quality Models

Singh, B., Kannojia, S. P.

Year:

2013

Language:

english

File:

PDF, 734 KB

english, 2013

17

[IEEE 2016 11th International Conference on Industrial and Information Systems (ICIIS) - Roorkee, India (2016.12.3-2016.12.4)] 2016 11th International Conference on Industrial and Information Systems (ICIIS) - A text to speech synthesizer using acoustic unit based concatenation for any Indian language of Devanagari script

Kannojia, Shilpi, Singh, Ghanapriya, Mathur, Sanjay

Year:

2016

Language:

english

File:

PDF, 293 KB

english, 2016

18

Challenges in fabrication of high aspect ratio electrostatic comb-drive microactuator using one-step X-ray lithography

Shukla, Rahul, Kannojia, Harindra Kumar, Mukherjee, C., Sankar, P. Ram, Thakur, B. S., Sinha, A. K., Pandey, Dhananjai

Journal:

ISSS Journal of Micro and Smart Systems

Year:

2020

File:

PDF, 2.41 MB

2020

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